杨亮，华中科技大学博士，副教授，硕士生导师。
长期从事半导体光电器件封装测试、封装工艺开发及失效分析、各种功能材料的制备开发和应用、材料成分和器件失效分析等领域的科研和教学工作。主持各类科研项目10项，其中：主持国家自然科学基金青年项目1项、主持福建省自然科学基金面上项目2项、省教育厅项目中青年教育科研项目1项；横向项目1项到校经费42万；主持校级教研教改项目2项，荣获学院教学竞赛荣获二等奖；获国家基金委2020公派出国名额，多次参加进修及继续教育，超额完成继续教育学时；2014.4-至今，担任68个本科学生的指导教师，2020.09-至今，担任11名研究生的指导教师；被评为2019，2021年度优秀教师；2020年入选厦门市高层次人才（C类）；荣获2021年厦门市科学技术进步奖二等奖（高光学品质LED照明器件的关键制造技术及应用）。以第一发明人身份公开发明专利3项，实用新型专利2项（授权）；在《Materials Today Chemistry》、《Ceramics International》、《Journal of Alloys and Compounds》、《Inorganic Chemistry Communications》、《Optics Letters》《Applied Optics》、《IEEE Transactions on Components, Packaging and Manufacturing Technology》、《光学学报》等知名期刊上发表学术论文30余篇。
主讲课程：芯片制造技术，半导体照明，半导体元器件封装，材料现代分析测试方法，电子封装可靠性实验。
教育与工作经历：
2014.04-至今 厦门理工学院，电子封装技术专业，专任教师
2008.09-2013.12 华中科技大学，机械科学与工程学院，机械制造及其自动化，硕博连读（光电国家实验室微机电系统研究部）
主要荣誉：
2020年入选厦门市高层次人才C类
2021年厦门市科学技术进步奖二等奖（高光学品质LED照明器件的关键制造技术及应用）排名六
研究方向：
1.半导体光电器件封装测试
2.封装设计及工艺开发
3.功能材料开发应用
4.材料成分和器件失效分析
近年来承担的主要科研项目：
1. 国家自然科学基金，基于Sn-P-F-O基质的低熔点BSSO、SCASN荧光粉掺杂复合材料的制备、测试和封装机理研究/61904156，起止时间：2019.01-2021.12，主持
2. 福建省科技特派团服务产业链重点项目，户外LED灯具长寿命耐候性材料及聚丙烯免预处理粘接关键技术研发/2024N0027,起止时间：2024.10-2027.10，主持
3. 福建省人力资源和社会保障厅2024-2025年高层次人才资助项目/GBXX2024057
4. 福建省中国科学院产业化项目，适用于高功率LED灯丝电子封装材料的研发/2024T3070，起止时间：2024.05-2026.05，参与
5.福建省自然科学基金面上项目，基于微流体控制技术的荧光粉保形涂覆原理及工艺研究/2016J01322，起止时间：2016.06-2019.06，主持
6.福建省自然科学基金面上项目，荧光粉共掺低熔点玻璃基质复合材料的制备、测试和封装机理研究/2020J01293,起止时间：2020.01-2022.12 ,主持
7.福建省教育厅A类项目/JAT160351，荧光粉保形涂覆原理及工艺实现，起止时间：2016.07-2019.07，主持
8.企业横向项目，陶瓷加热器件失效分析，2020.11-2022.06,主持
9.厦门理工高层次人才项目，大功率LED用荧光陶瓷的制备、表征和封装测试/E2014117，起止时间：2014.06-2017.06，主持
10.厦门理工科技攀登计划项目，LED封装及灯具一体化集成制造/XPDKQ18009，起止时间：2018.07-2020.07，主持
近年来发表的代表性学术论著：
1. Tiqun Wei, Liang Yang*, Zhihao Jiang, Zihao Han, Jianwei Dao,Run Hu*. Full-Spectrum Solid-State Lighting with Ultra-High Color Rendering Index Exceeding 96 Based on Low Melting Point Tin-Fluorophosphate Glass Matrix. Materials Today Chemistry, 2025.
2. Jianwei Dao, Liang Yang*, Zhihao Jiang, Zihao Han, Tiqin Wei. Novel near-UV-excitable Eu3+ doped K3Ca2(SO4)3X (X = F, Cl, Br) halosulphate phosphors for white LEDs. Inorganic Chemistry Communications, 2025: 114970.
3. Yan Wang, Jianwei Dao, Zhihao Jiang, Zihao Han, Liang Yang*, Tiqun Wei, An Xie, Zhicheng Lv*. Novel green-emitting BaY2Al4SiO12:Ce3+ garnet phosphors with superior internal quantum efficiency for high color rendering white LEDs. Journal of Alloys and Compounds, 2025.1027: 180514.
4. Jianwei Dao, Zihao Han, Zhihao Jiang, Tiquna Wei, Junlina Xue, Bin Wang, Sicheng Yi, Liang Yang*. Enhancement of luminescence properties and thermal stability of near-UV-excitable KSr1-x-yCayPO4:xEu3+ red phosphors by substituting Sr with Ca for white LEDs. Ceramics International, 2025.51(10): 12853-12864.
5. Taiping Han, Yan Wang, Liang Yang*, Deming Hu, Zhanghong Huang, Chunyan Cao, An Xie, Qin Zhang. Low Melting Point Phosphor-In-Glass (PiG) Realizing at a Normal Atmosphere and Packaged Performance with GaN LED. Journal of Nanoelectronics and Optoelectronics, 2022.17(8): 1207-1214.
6. Deming Hu; Kun Chen; Liang Yang*; Chunyan Cao; An Xie; Qingsong Zhang; Qin Zhang, Optimization of ZnO Nano Particles Preparation and Its Performance as Electron Transfer Layer in Quantum Light-Emitting Diode, Journal of Nanoelectronics and Optoelectronics, 2022, 17: 56-62.
7. 负性黑色光刻胶光刻工艺参数的优化研究，王岩; 李杰欣; 杨亮*，Material Sciences 材料科学, 2022, 12(4): 316-324.
8. Yan Wang; Liang Yang*; Taiping Han; Deming Hu; Kun Chen; An Xie; Chunyan Cao; Xiayun Shu, Posphor-glass by the pressureless sintering for 3D printing technology, 23rd International Conference on Electronic Packaging Technology, Dalian, 2022-8-9.
9. Taiping Han; Liang Yang*; Yan Wang; Deming Hu; Kun Chen; An Xie; Chunyan Cao; Xiayun Shu, Preparation and Properties of CaY2HfAl4O12:Ce3+ Phosphor Packed with High Power LED, 23rd International Conference on Electronic Packaging Technology, Dalian, 2022-8-11.
10. Kun Chen; Deming Hu; Liang Yang*, The Influence of Different Phosphor Coating Methods on the Temperature of LED,2021 22nd International Conference on Electronic Packaging Technology (ICEPT), 2021, 5(12): 1.
11. Deming Hu; Liang Yang; An Xie; Chunyan Cao; Xiayun Shu; Chenrui Fan; Jinrong Deng; Kun Chen, Preparation and Properties of Low Melting Point Sn-P-F-O-Matrix Phosphor-in-Glass for white LED,2021 22nd International Conference on Electronic Packaging Technology (ICEPT), 2021, 6(10): 1.
12. Liang Yang, Qin Zhang, Feng Li, An Xie, Long Mao, Jidong Ma. Thermally stable lead-free phosphor in glass enhancement performance of light emitting diodes applicationl. Applied Optics, 2019. 58(15): 4009-4014.
13. 张文静，张芹，杨亮等，基于Spiro-OMeTAD电子阻挡层的量子点发光二极管电荷平衡改善，《光学学报》， 2019，39(5)， 296-304.
14. Liang Yang*, An Xie, Dan Xie, Xiayun Shu. A New Method of Robust Phosphor Glass Fabrication and Performances for LEDs.IEEE Proc. of ICEPT-HDP, 2015, 1258-1262.
15. Liang Yang, Mingxiang Chen, Zhicheng Lv, Simin Wang, Xiaogang Liu, Sheng Liu. Preparation of a YAG: Ce phosphor glass by screen-printing technology and its application in LED. Optics Letters, 2013, 38(13): 2240-2243.
16. Liang Yang, Simin Wang, Zhicheng Lv, Sheng Liu. Color deviation controlling of phosphor conformal coating by advanced spray painting technology for white LEDs. Applied Optics, 2013, 52(10): 2075-2079.
17. Liang Yang, Zhicheng Lv, Yuan Jiaojiao, Sheng Liu. Effects of MF resin and CaCO3 diffuser loaded encapsulation on CCT uniformity of the phosphor converted LEDs. Applied Optics, 2013, 52(22):5539-5544.
18. Liang Yang, Mingxiang Chen, Sheng Liu. Fabrication of Gel Glass Containing High Rendering Phosphor Mixture via Sol-Gel Process for LEDs. IEEE Proc. of ECTC, 2013, 2371-2374.
19. Liang Yang, Zhicheng Lv, Mingxiang Chen, Sheng Liu. Combination of Translucent Eu:YAG Glass Ceramic with LED chip. IEEE Proc. of ECTC, 2012, 2145-2149.
20. Liang Yang, Mingxiang Chen, Shan Yu, Zhicheng Lv, Sheng Liu. Fabrication of YAG Glass Ceramic and Its Application for Light Emitting Diodes. IEEE Proc. of ICEPT-HDP, 2012,1463-1466.
21. Liang Yang, Mingxiang Chen, Shengjun Zhou, Sheng Liu. Preparation of Phosphor Glass via Screen Printing Technology and Packaged Performance for LEDs. IEEE Proc. Of ICEPT -HDP, 2013, 1189- 1192.
22. Zhicheng Lv, Liang Yang, Jiaojiao Yuan, Jing Fang, Bin Cao, Sheng Liu, Study on Packaging Method Using Silicon Substrate with Cavity and TSV for Light Emitting Diodes. IEEE Transactions on Components, Packaging and Manufacturing Technology. 2013, 3(7):1123-1129.
23. Yu Shan, Yang Liang, Cao Bin, Zheng Huai, Cheng Mingxiang, Liu Sheng. Development Process of Phosphor Coating with Screen Printing for White Light Emitting Diode Packaging. IEEE Proc. of ICEPT-HDP, 2011, 1-5.
24. Zhicheng Lv, Jiaojiao Yuan, Jing Fang, Liang Yang, Xuefang Wang, Sheng Liu, Carrierless thin wafer handling for 3D integration, 13th International Conference on Electronic Packaging Technology & High Density Packaging, 2012, 922-925.
专利：一种硅通孔金属互联线电迁移测试结构（201110321630.5）
ü 一种硅通孔金属互联线电迁移测试结构 ( 201120402902.X） ü
一种LED倒装芯片的圆片级封装结构、方法及产品 （201310160891.2）
一种太阳高度角的测量仪 ( ZL202220231612.1.)
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