1.团队名称：材料先进成型技术研究
2.团队负责人：张亮 教授
3.团队成员：赵军，林佳，李辉，李奋强，储彬，李威挺，王金伙，彭思远，黄贵美，陈宇豪
4.团队研究方向：
（1）新型连接材料与技术
（2）生物医疗材料成型技术
（3）智能模具与塑性加工
（4）增材制造(3D)技术
5.团队负责人简介：
张亮
6.团队成员简介：
7.代表性科研成果：
（1）科研项目
[1] 林佳，国家自然科学基金面上项目，52173266，3D打印Si-Zr-O-C基仿生梯度功能复合材料及其隔热/承载性能的研究，2022.01-2025.12，58万元，已结题，主持。
[2] 林佳，国家自然科学基金面上项目，51772253，可用于3D打印的Zr-B-Si-C超高温陶瓷材料设计与原位合成研究，2018.01-2021.12，59万元，已结题，主持。
[3] 林佳，国家自然科学基金青年基金项目，51402248，原位自生碳纳米管增韧二硼化钛基陶瓷的韧化机制研究，2015.01-2017.12，25万元，已结题，主持。
[4] 张亮，福建省引才“百人计划”，闽委组通[2024]58号，2025.1-2027.12，100万元，在研，主持。
[5] 张亮，新型钎焊材料与技术国家重点实验室开放课题，SKLABFMT-2023-02，基于磁流变效应的芯片堆叠钢筋混凝土焊点改性机理研究，2024.01-2025.12，30万元，在研，主持。
[6] 张亮，福建省“闽江学者”特聘教授，闽教高[2022]4号，2022.9-2025.09，200万元，在研，主持。
[7] 张亮，河南省特聘研究员，特聘字第941-2019-001号，面向智能制造的环境友好型钎料开发与应用，2019.5-2025.4，300万元，已结题，主持。
[8] 储彬，福建省自然科学基金面上项目，2024J011207，3D打印抗瘢痕真皮修复材料的研究，2024.11-2027.10，9万，在研，主持。
[9] 彭思远，福建省自然科学基金面上项目，2024J011212，墨水直写高γ'相强化高温合金的组织性能调控及γ'相析出行为研究，2024.11-2027.10，10万元，在研，主持。
[10] 林佳，福建省自然科学基金面上项目，2023J011454，基于光固化3D打印的CNTs/Si-O-C仿生梯度多孔复合材料的制备及性能研究，2023.01-2026.01，8万元，在研，主持。
[11] 王金伙，福建省自然科学基金面上项目，2020J01289，连续纤维增强高分子复合材料摩擦过程中的流变行为研究，2020.11-2023.11，7万元，已结题，主持。
[12] 林佳，福建省自然科学基金面上项目，2018J01523，基于立体光刻3D打印技术的Zr-B-Si-C系超高温陶瓷材料的研究，2018.04-2021.04，8万元，已结题，主持。
[13] 赵军，福建省自然科学基金面上项目，2018J01522，弧齿锥齿轮局部共轭滚轧近净成形机理研究，2018.04-2021.04，8万元，已结题，主持。
[14] 李辉，福建省教育厅A类项目，JA11229，汽车空滤器高效成型关键技术产业化研究，2011.5-2013.12，5万元，已结题，主持。
[15] 赵军，福建省重点项目，2013H0049，高敏度汽车制动泵关键技术研究，15万元，已结题，主持。
[16] 李辉，福建省科技厅资助省属高校项目，2007F5095，实用化铜合金铸造工艺CAD的开发与应用，2007.10-2010.1，5万元，已结题，主持。
[17] 张亮，江苏省自然科学基金面上项目，BK20211351，三维封装芯片超声纳米低温键合机理及可靠性研究，2021.7-2024.7，10万元，已结题，主持。
[18] 张亮，厦门市杰出青年人才，2023.1-2025.12，50万元，在研，主持。
[19] 陈宇豪，厦门市自然科学基金青年项目，3502Z202572031，间隙氮调控FeCoNiMnTi高熵合金表面重构及析氧性能研究，2025.07-2028.06，5万元，在研，主持。
[20] 张亮，厦门市自然科学基金项目，3502Z202473067，面向三维封装的芯片堆叠焊点改性机理与可靠性研究，主持，2024.07-2027.06，8万元，在研，主持。
[21] 彭思远，厦门市自然科学基金青年项目，3502Z202371022，基于DIW-AlCoCrFeNi2.1共晶高熵合金的制备及变形机制研究，2023.07-2026.06，5万元，在研，主持。
[22] 赵军，厦门市自然科学基金项目，3502Z20227222，温度对钛合金ECAP变形及微观组织的影响机理研究，2022.07-2025.06，X万元，已结题，主持。
[23] 李辉，厦门市科技计划项目，3502Z20133038，EPS系统支撑壳体精密压铸成型技术的研究与应用，2013.6-2015.12，X万元，已结题，主持。
[24] 赵军，厦门市产学研项目，2023CXY0405，缸体分离式制动钳关键技术研发，5万元，主持。
[25] 储彬，深圳市自然科学基金面上项目，JCYJ20210324100601005，3D打印真皮材料对创面血管化及瘢痕的影响及机制研究，2021.10-2024.10，40万，已结题，主持。
[26] 储彬，深圳市科技计划项目，JCYJ20140905153253218，掺钴磷酸钙的研制及其在增强成血管化成骨中的意义研究，2015.01-2017.01，20万元，已结题，主持。
[27] 储彬，深圳市战略性新兴产业发展专项资金项目，JCYJ20130401174236667，抗瘢痕挛缩真皮仿生材料的研究，2013.07-2015.08，10万元，已结题，主持。
（2）部分授权发明专利
[1] 张亮等，一种钎料及其制备方法，ZL202210037682.8，2023.12.
[2] 张亮等，一种无镉银钎焊材料，ZL202210307654.3，2023.09.
[3] 张亮等，一种可实现CSP器件高强度互连的Sn基钎料，ZL202111004674.5，2023.01.
[4] 林佳等，一种Si-Zr-O-C陶瓷材料及其制备方法，ZL202310015579.8，2023.10.
[5] 林佳等，一种ZrB2基超高温陶瓷结构及其光固化3D打印方法和装置，ZL201910309889.4，2021.09.
[6] 林佳等，一种光敏性Zr-B-Si-C陶瓷前驱体及其原位制备方法，ZL201910309890.7，2019.07.
[7] 林佳等，一种CNTs增韧TiB2陶瓷复合材料及其制备方法，ZL201510539783.5，2015.12.
[8] 林佳等，一种超高温CNTs/TiB2-SiC陶瓷复合材料及其制备方法，ZL201510561635.3，2015.12.
[9] 林佳等，一种原位合成CNTs增韧TiB2基超高温陶瓷材料的制备方法，ZL201510539816.6，2015.12.
[10] 李辉等，折叠纸芯嵌件入模方法及其放置机，ZL201010294484.7，2012.11.
[11] 李辉等，自动冲水装置，ZL201210040820.4，2013.12.
[12] 李辉等，真空机，ZL201510500913.4，2017.06.
[13] 李辉等，一种托盘式流水线自动送料装置，201710890159.9，2019.04.
[14] 李辉等，一种托盘式流水线自动检测装置，201710891400.X，2019.04.
[15] 李辉等，一种镜片上膜撕膜装置，201710748152.3，2019.05.
[16] 李辉等，一种镜片撕膜装置，201710748142.X，2017.08.
[17] 李辉等，一种人体用电动通便器及其控制方法，201710144630.X，2017.03.
[18] 李辉等，一种真空压铸辅助成型系统，ZL201510500844.7，2017.06.
[19] 李辉等，一种设有局部增压机构的高精密压铸模具及浇铸方法，ZL201510417586.6，2017.08.
[20] 李辉等，一种金属3D打印机防尘的精密铺粉机构，ZL201611083927.1，2019.04.
[21] 李辉等，一种气流平稳的金属3D打印机进出风结构，ZL201710054956.3，2019.02.
[22] 李奋强等，基于电磁高能率下的薄板材料成形极限的测量装置及方法，201510666934.3，2015.10.
[23] 李奋强等，一种电流辅助电磁冲裁加工装置及其控制方法，201710521107.4，2017.06.
[24] 李奋强等，一种带超声波辅助的电磁铆接装置，202222235841.3，2022.08.
[25] 李奋强等，一种高致密零件及其压制方法、压制装置，202210443320.9，2022.04.
[26] 王金伙等，一种预浸布动摩擦系数竖直测量装置及测量方法，ZL201910059513.2，2019.04.
[27] 王金伙等，一种高分子材料摩擦系数倾斜测量装置及测量方法，ZL201910060358.6，2019.04.
[28] 陈宇豪等，高强度铝硅合金焊丝，CN202010483321.7，2021.12.
[29] 陈宇豪等，一种多场辅助的钎焊装置及钎焊方法，CN201710227050.7，2023.05.
（3）2024年发表的部分学术论文
[1] Wu Chuan-Jiang, Huang Pei-pei,Zhang Liang*, Guo Xing-yu, ChenMo, Jiang Nan, Kim Hyoung Seop*,Chen Yu-hao. The effect of Ga on interfacial reactions and intermetallic evolution in SnBiGaIn quaternary alloys[J]. Journal of Alloys and Compounds, 2025, 1037:182337. (SCI)
[2] Zhang Jia-min,Zhang Liang*,Yu-hao Chen, Long Wei-min, Liu Yun-xin. Effect of added Ni nanoparticles on the microstructure and mechanical properties of Sn-58Bi/Cu solder joints under thermal shock conditions[J]. Advanced Electronics Materials, 2025, e00197. (SCI)
[3] Wu Chuan-jiang,Zhang Liang*, Nan Jiang, Kim Hyoung Seop*,Yu-hao Chen. Effect of horizontal magnetic field on the microstructure and mechanical properties of Ti nanoparticles-reinforced Sn1.0Ag0.5Cu solder: experimental and first-principles calculations[J]. Journal of Materials Processing Technology, 2025, 342:118949. (SCI)
[4] Wu Chuan-jiang,Zhang Liang*,Yu-hao Chen, Yu Xin-quan, Lu Quan-bin, Long Wei-min*. Effect of magnetic field on precipitation kinetics and shear strength of Sn58Bi-Ni solders[J]. Materials & Design, 2025, 255:114158. (SCI)
[5] Guo Xing-yu,Zhang Liang*,Chen Yu-hao, Kim Hyoung Seop, Jiang Nan, Wu Chuan-jiang, Xi Huang, Yun-xin Liu. First-principles and experimental investigations on the mechanical properties of Co particles modified Sn-1.0Ag-0.5Cu solder[J]. Results in Engineering, 2025, 26:105356. (SCI)
[6] Zhang Jia-min,Zhang Liang*,Chen Yu-hao, Long Wei-min, Zhang Xiao-bin. Foam Ni-Cu enhancement of ultrasound-assisted Cu/Sn58Bi/Cu joint properties[J]. Materials Characterization, 2025, 225:115114. (SCI)
[7] Zhang Jia-min,Zhang Liang*,Chen Yu-hao, Long Wei-min, Zhang Xiao-bin. Foam Ni-Cu enhancement of ultrasound-assisted Cu/Sn58Bi/Cu joint properties[J]. Materials Characterization, 2025, 225:115114. (SCI)
[8] Deng Kai,Zhang Liang*, Gao Li-Li, Zhao Meng, Zhang Xiao-Bin, Chen Mo, Yu Xin-Quan, Lu Quan-Bin, Sun Lei. Effect of ultrasonic conditions on microstructural and mechanical of Sn58Bi and Sn58Bi solder joints with 0.6 % Si3N4 nanoparticles[J]. Materials Characterization, 2025, 224:115019. (SCI)
[9] Huang Xi,Zhang Liang*, Gao Li-li, Zhao Meng, Yu Xin-quan, Lu Quan-bin. Performance transformation of Co-added Sn58Bi solder joints under thermal shock conditions for interconnection packaging[J]. Intermetallics, 2025, 181:108729. (SCI)
[10] Chen Mo,Zhang Liang*,Chen Yu Hao, Jiang Nian, Yu Xin-quan, Lu Quan-bin. Effect of doping Si3N4 nanoparticles on the properties and microstructure of Sn1.0Ag0.5Cu solder[J]. Materials Today Communications, 2025, 43:111728. (SCI)
[11] Zhang Jiamin,Zhang Liang*, Huang Xi, Wu Chuanjiang, Deng Kai, Long Wei-Min. Effect of adding Ni nanoparticles on the melting characteristics, mechanical properties and intermetallic compound growth of Sn58Bi solder[J]. Soldering & Surface Mount Technology, 2025, 37(1):60-70. (SCI)
[12] Chen Chen,Zhang Liang*, Chen Mo, Huang Xi, Wu Chuan-jiang. Application of ultrasonic power in forming Sn58Bi/Cu solder joints with trace Si3N4 nanowire doping[J]. Journal of Materials Engineering and Performance, 2025, 34: 5263-5272. (SCI)
[13] Deng Kai,Zhang Liang*, Influence of doping Si3N4 nanoparticles on the properties and microstructure of Sn58Bi solder for connecting Cu substrate[J]. Soldering & Surface Mount Technology，2025, 37 :97-107. (SCI)
[14] Yibin Huang, Siyuan Peng, Yifan Chen,Bin Chu*. Agarose Hydrogels for Bone Tissue Engineering, from Injectables to Bioprinting. Gels. 2025, 11, 255. (SCI)
[15] Bin Chu*, Yibin Huang, Yifan Chen, Song Wang, Xiaoli Li. A chondroitin sulfate/chitosan composite coating for anticoagulation on cardiovascular implants. International Journal of Biological Macromolecules. 2025, 307, 142345. (SCI)
[16] Luo Shuyuan,Zhao Jun*, Jia Bin. BFL-YOLOv8: Surface Defect Detection Algorithm for Titanium Alloy Plates Based on Improved YOLOv8. Insight, 2025, 67(4), 208-214. (SCI)
[17] J Zhao，Q S Niu，H J Xu. Study on the Equal Diameter Angle Extrusion Process of Titanium Alloy Based on Fuzzy System Temperature Control. J. of Materi Eng and Perform (2025). (SCI)
[18] Qingsong Niu, Jun Zhao*; Bin Jia; Shuyuan Luo，Effect of WC Mass Fraction on the Microstructure and Frictional Wear Properties of WC/GH3536 Matrix Composites Fabricated by Selective Laser Melting, Materials Letters, 2025 (392), 138555. (SCI)
[19] F. Li, J. Shu, Q. Wang, J. Ding, X. Xu,J. Zhao. Effect of selective laser melting process parameters on the microstructure and properties of WCu20 composite. International Journal of Refractory Metals and Hard Materials, 2025, 129: 107130. (SCI)
[20] Wu Chuan-jiang,Zhang Liang*, Gu Si-yong, Nan Jiang, Kim Hyoung Seop*,Yu-hao Chen. Shear properties of low-temperature soldered joints of aluminum nitride metallized with Sn-1.0Ag-0.5Cu-Ti alloys[J]. Materials Characterization, 2024, 218:114561. (SCI)
[21] Wu Chuanjiang,Zhang Liang*, Sun Lei, Lu Xiao, Chen Chen. Interfacial reaction of Cu/SAC105/Cu solder joints reinforced with Ti nanoparticles under vacuum thermo-compression bonding[J]. Journal of Materials Research and Technology, 29 2024, 5562-5575. (SCI)
[22] Deng Kai,Zhang Liang*, Chen Mo, Huang Pei-pei, Effect of Si3N4 nanoparticles on IMC as well as mechanical properties of Sn58Bi/Cu solder joints during thermal aging[J]. Journal of Materials Research and Technology, 2024, 30:9140-9147. (SCI)
[23] Huang Xi,Zhang Liang*,Chen Yu-hao*, Sun Lei, Yu Xin-quan, Lu Quan-bin. Ni mesh-reinforced ultrasonic-assisted Cu/Sn58Bi/Cu joint performance: Experiments and first-principles calculations[J]. Ultrasonics Sonochemistry, 2024, 111：107119. (SCI)
[24] Wu Chuan-jiang,Zhang Liang*, Gu Si-yong, Nan Jiang, Kim Hyoung Seop*,Yu-hao Chen. Shear properties of low-temperature soldered joints of aluminum nitride metallized with Sn-1.0Ag-0.5Cu-Ti alloys[J]. Materials Characterization, 2024, 218:114561. (SCI)
[25] Chen Chen,Zhang Liang*, Huang Xi, Lu Xiao. Effect of Si3N4 nanowires doping on microstructure and properties of Sn58Bi solder for Cu bonding[J]. Soldering & Surface Mount Technology,2024, 36(1):8-19. (SCI)
[26] Huang Xi,Zhang Liang*, Deng Kai, Sun Lei. Impact of Co on Thermal Aging in Sn58Bi/Cu Solder Joints: IMC Growth and Transformation in Mechanical Properties[J]. Metals and Materials International, 2024, 30:3127-3139. (SCI)
[27] Chen Chen,Zhang Liang*, Guo Xing-yu, Zhang Jia-min, Huang Xi. Optimizing temperature gradient for rapid fabrication of Cu/Sn/Cu full intermetallic compounds joints via vacuum thermal compression bonding[J]. Journal of Materials Science: Materials in Electronics, 2024, 35:823. (SCI)
[28] Huang Xi,Zhang Liang*, Deng Kai, Sun Lei. Investigating the impact of cobalt incorporation on the transformation of Cu6Sn5 layer to (Cu, Co)6Sn5: Microstructural and mechanical insights[J]. Materials Characterization, 2024, 212:113934. (SCI)
[29] Wu Chuan-jiang,Zhang Liang*, Chen Chen, Lu Xiao. Thermal, microstructural, wettability and mechanical properties of Sn1.0Ag0.5Cu composite solder modified with Ti nanoparticles[J]. Materials Characterization, 2024, 212:113927. (SCI)
[30] Chen Chen,Zhang Liang*, Impacts of temperature gradient on microstructure and properties of Cu/Sn58Bi-0.6B4C NPs/Cu joints fabricated by vacuum thermal compression bonding[J]. Materials Today Communications, 2024, 38:108210. (SCI)
[31] Huang Xi,Zhang Liang*, Zhang Jia-Min, Chen Chen, Lu Xiao, Sun Lei. Intermetallic compound growth behavior and mechanical performance in Sn58Bi/Cu solder joint bearing Mg particles incorporation during thermal aging[J]. Materials Characterization, 2024, 208:113618. (SCI)
[32] Huang Xi,Zhang Liang*, Chen Chen, Lu Xiao, Wang Xi. Orthogonal design optimization for Cu/Sn58Bi-0.4Mg/Cu solder joint strength in ultrasonic-assisted soldering[J]. Materials Today Communications, 2024, 38:107669. (SCI)
[33] Lu Xiao,Zhang Liang*, Liu Zhi-quan*, Gao Li-yin, Chen Chen, Wu Chuan-jiang, Huang Xi, Deng Kai. Significant inhibition of interfacial Cu6Sn5 IMC and improvement of solder joint strength and reliability by applying (111) nanotwinned Cu substrate and vacuum soldering[J]. Materials Characterization, 2024, 208:113668. (SCI)
[34] Wu Chuan-jiang,Zhang Liang*, Chen Chen, Lu Xiao. Enhancement of SAC105 solder for vacuum soldering with Cu substrates through incorporation of activated Ti nanoparticles[J]. Journal of Materials Research and Technology, 2024, 28:266-279. (SCI)
[35] Zhang Liang*. Formation and growth mechanism of thin Cu6Sn5 films in Sn/Cu and Sn-0.1AlN/Cu structures using laser heating[J]. Soldering & Surface Mount Technology, 2024, 36(5):268-275. (SCI)
[36] Hengyu Zhang,Jun Zhao* Qingsong Niu, Chao Xu, Ruqing Huo. A Study of energy absorption properties of Heteromorphic TPMS and Multi-morphology TPMS under quasi-static compression, Thin-Walled Structures, 205 (2024) 112519. (SCI)
[37] Jia Lin*, Shuai Wang, Hua Jin*, Rongwen Wang, Shuyuan Cui, Yihang Yang, Jinhuo Wang, Guimei Huang. Preparation of Si-O-C-based Precursor Ceramics for Photo-curing 3D Printing: Selection of Silicone Prepolymer System and Photoinitiator [J]. Journal of Materials Engineering and Performance, 34(9), AdvanMan, 2024. (SCI)
[38] Jia Lin*, Shuai Wang, Hua Jin*, Rongwen Wang, Shuyuan Cui, Yihang Yang, Jinhuo Wang, Guimei Huang. Preparation of Si-O-C-based Precursor Ceramics for Photo-curing 3D Printing: Selection of Silicone Prepolymer System and Photoinitiator [J]. Journal of Materials Engineering and Performance, 34(9), AdvanMan, 2024. (SCI)
[39] 袁益民,李辉,谢鹏远,等.工艺参数对激光选区熔化316L零件电解质等离子抛光的影响[J].电镀与涂饰, 2024(003):043.
[40] 宰建轩,李辉,葛晓宏,等.高密度芯片激光钎焊温度场及应力场数值模拟研究[J].电焊机, 2024(003):054.
[41] Houqiang Wang,Hui Li; Jinhuo Wang, Fenqiang Li, Li Hu,Microstructural Evolution and Strengthening Mechanism in Laser Powder Bed Fusion 316L Stainless Steel with High Strength and Ductility, Journal of Materials Engineering and Performance, 2024. (SCI)
[42] Fenqiang Li,Qianting Wang, Jiawei Shu, Hao Chen,Hui Li. Numerical simulation and experimental study on wetting of Sn-based solder for laser soldering. Journal of Mechanical Science and Technology 38 (6) 2024. (SCI)
[43] Bin Chu*, Yun-Feng Chu, Jin-Mei He, Zhi-Wei Lin, Chang-Sheng Chen, Song Wang, Wei-Qiang Liu, Xiao-Li Li. A nature-inspired multifunctional adhesive for cartilage tissue -- biomaterial integration. Soft Matter. 2024, 20, 2017-2023. (SCI)
[44] Changsheng Chen, Deguang Wu, Zhen Wang, Lanlan Liu, Jinmei He, Jian Li,Bin Chu*, Song Wang, Bo Yu, Weiqiang Liu. Peptide-Based Hydrogel Scaffold Facilitates Articular Cartilage Damage Repair. ACS Applied Materials & Interfaces. 2024, 16, 11336-11348. (SCI)
[45] Siyuan Peng1, Shuai Feng1, Zhenfei Jiang, Jie Ren, Shengbiao Zhang, Yanfang Liu, Liang Zhang, Wenyi He, Zhongqiang Liu, Shuai Guan*, Zhiyu Xiao*, Wen Chen*, High strength and ductility in a dual-phase hetero-structured AlCoCrFeNi2.1 eutectic high-entropy alloy by powder metallurgy, Materials Research Letters, 2024. (SCI)
[46] Shuai Feng, Shuai Guan, Xiangkui Liu,Siyuan Peng, Kewei Dong, Yang Yang, Xinsheng Chen, Yuzheng Liang, Qipeng Wang, Yanfang Liu, Yong Peng, Kehong Wang, Wen Chen, Jian Kong, Lightweight Co-free eutectic high-entropy alloy with high strength and ductility by casting, Materials Research Letters, 2024. (SCI)
[47] Yuhao Chen, Jiang Xu, Yujie Chen, et al. Rapid Defect Engineering in FeCoNi/FeAl2O4 Hybrid for Enhanced Oxygen Evolution Catalysis: A Pathway to High-Performance Electrocatalysts[J]. Angewandte Chemie International Edition, 2024, e202405372.(SCI)
[48] Yuhao Chen, Jiang Xu, Minming Jiang, et al. Enhancing Oxygen Evolution Reaction Performance: Electrochemical Activation of the Biphasic CoNi/Zn(Fe,Al,Cr)2O4 via Controlled Aluminum Leaching Facilitated Surface Reconstruction[J]. Advanced Energy Materials, 2024, 14(9), 2303450. (SCI)
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欢迎企业界朋友洽谈产学研合作和人才培养，欢迎报考本团队研究生
